Lookup Lead-Free Products and Content Data
Non-Lead-Free Soldering Remarks
Dallas Semiconductor/Maxim Integrated Products meets JEDEC standard 020A which specifies that a 220(+5/-0) degree
Celsius maximum peak temperature profile should be used for packages measuring a thickness of <2.5mm, and a
volume of >350mm3. JEDEC 020A also specifies a 235(+5/-0) degree Celsius maximum peak temperature profile for
packages measuring thickness of <2.5mm, and a volume of <350mm3. Approximately 90% of Dallas Semiconductor/Maxim
Integrated Products packages are subject to a 240 degree Celsius maximum peak temperature profile.
JEDEC Solder Reflow Profile for Packages Containing Lead (PDF,7K).
Plating Thickness
Lead frames for all parts have a plating thickness of 300 - 800 microinches (µ-inch), or 7.5 to 20 microns.
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